Google has announced that its upcoming Tensor G4 chip will feature a new packaging method from Samsung, aimed at enhancing power efficiency and heat management. The chip will utilize Samsung’s latest 4nm process and packaging technology, specifically the Fan-out Wafer Level Packaging (FOWLP) method.
This new packaging method is projected to deliver improved heat management and power efficiency compared to the previous Tensor G3 chip. While Tensor G4 is considered a minor upgrade from the G3, the focus on enhancing heat and power efficiency is expected to be a significant improvement.
However, Google is already looking ahead to the future, with plans to transition away from Samsung for the release of the Tensor G5 in the 2025 Pixel 10 series. The tech giant is set to collaborate with Taiwan Semiconductor Manufacturing Company (TSMC) for the production of the next-generation chip.
In the meantime, the Tensor G4 is set to be utilized in the Pixel 9 series and the upcoming Pixel Fold 2. For those interested in staying up-to-date with the latest news on Google Pixel devices, tech enthusiast Ben can be followed on Twitter, Threads, and Instagram.
Stay tuned for more updates on the advancements and developments in the world of mobile technology as Google continues to innovate and improve its hardware offerings.
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